Stability of Electrodeposition at Solid-Solid Interfaces and Implications for Metal Anodes

摘要

We generalize the conditions for stable electrodeposition at isotropicsolid-solid interfaces using a kinetic model which incorporates the effects ofstresses and surface tension at the interface. We develop a stability diagramthat shows two regimes of stability: previously known pressure-driven mechanismand a new density-driven stability mechanism that is governed by the relativedensity of metal in the two phases. We show that inorganic solids and solidpolymers generally do not lead to stable electrodeposition, and provide designguidelines for achieving stable electrodeposition.